部分めっき方法

摘要

To provide a method for partial plating, when forming a plating film on a small area in a band plate-shaped strip material continuously conveyed along the longitudinal direction, capable for forming a plating film with a sufficient positional accuracy having a relatively uniform thickness without lowering the transport speed of the strip material or elongating the conveyance route.SOLUTION: A partial plating method includes: formation of a positive resist such as an alkali stripping type electrodepositing resist coating on a surface of a base material; formation of an opening which penetrates through the electrodepositing resist coating by removing a predetermined portion of the electrodepositing resist coating with a laser processing machine such as YVOlaser marker having a wavelength of 300 to 1200 nm; and peeling the electrodepositing resist coating by making it dissolved in an alkaline solution after forming a plating film on the opening of the electrodepositing resist coating.SELECTED DRAWING: Figure 1