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Inner circumferential surface processing apparatus and inner circumferential surface processing method

机译:内周面处理装置及内周面处理方法

摘要

An inner surface machining apparatus and an inner surface machining method for machining an inner circumferential surface of a cylinder portion of a workpiece having a cylinder bore formed therein, in which machining cost is reduced and machining quality and yield are improved. An inner peripheral surface processing apparatus 1 includes a grinding processing unit 10 for performing a grinding process for grinding an inner peripheral surface C0 of a cylinder section C with a grinding stone 11, and an inner peripheral surface of a cylinder section C with a plurality of honing stones 21. Honing processing unit 20 for honing processing for polishing C0, work conveying unit 30 for arranging cylinder section C at grinding processing position facing grinding wheel 11 and honing processing position facing grinding wheel holder 22, cylinder section C A control unit that performs inner peripheral surface processing control to perform honing processing on the inner peripheral surface C0 by arranging the cylinder portion C at the honing processing position after performing grinding processing on the inner peripheral surface C0 with the above-mentioned grinding processing position And 40. [Selected figure] Figure 1
机译:本发明涉及一种内表面加工装置和内表面加工方法,用于加工其中形成有缸孔的工件的缸体部分的内周表面,从而降低了加工成本并且提高了加工质量和成品率。内周面处理装置1包括:研磨处理单元10,其用于进行研磨处理,以利用磨石11对圆筒部C的内周面C0进行研磨;以及圆筒部C的内周面具有多个。珩磨石21。用于抛光C0的珩磨处理的珩磨处理单元20,用于将筒形部C布置在面对砂轮11的研磨处理位置和面对砂轮保持架22的珩磨处理位置的工件输送单元30,进行内部磨削的筒形部CA控制单元外周面加工控制,通过在具有上述磨削加工位置和40的内周面C0上进行磨削加工后,通过将圆筒部C配置在珩磨加工位置,从而对内周面C0进行珩磨加工。图1

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