Optical inspection device and optical inspection method for visible light and infrared light for semiconductor components

摘要

The optical investigation device (200) is suitable for detecting the characteristics of the semiconductor component (2) and is defined as such. The investigation device comprises a first lighting arrangement (4, 6), a second lighting arrangement (8, 10) and a device (12, 14) for providing an image, the first lighting arrangement being of a semiconductor component. Infrared light is emitted to the first surface opposite to the device (camera) that provides the image. Infrared light penetrates the semiconductor component completely at least in a certain proportion. The second illumination arrangement emits visible light to a second surface of the semiconductor component that faces the image-providing device. An apparatus for providing an image detects an optical spectrum emitted from the first and second illumination arrangements, and an image evaluation arranged at a subsequent stage based on both the visible light spectrum and the infrared light spectrum. In order to determine the characteristic error or damage of the semiconductor component, it is formed and arranged to provide a separate image capture. [Selection] Figure 2