Optical inspection device and optical inspection method with visible and infrared light for semiconductor devices

摘要

Optical examination device (100, 200) suitable and intended for detecting properties of a rectangular semiconductor device (2), comprising: a first illumination arrangement (4, 6), a second illumination arrangement (8, 10) and an imaging device (12, 14) in that the imaging device (12, 14) comprises at least a first imaging sensor (12) and a second imaging sensor (14), wherein the first imaging sensor (12) and the second imaging sensor (14) each face different surfaces of the semiconductor device (12). 2), and the first illumination arrangement (4, 6) emits infrared light respectively perpendicular to two surfaces of the semiconductor device (2) facing away from the imaging device (12, 14), wherein the infrared light at least partially completely completes the semiconductor device (2) penetrates, and the second illumination assembly (8, 10) visible light respectively perpendicular to two of the imaging device (12, 14) emit respectively facing surfaces of the semiconductor device (2), wherein the first illumination arrangement (4, 6) and the second illumination arrangement (8, 10) illuminate the semiconductor device (2) simultaneously, and the first imaging sensor (12) and second imaging sensors (14) are each configured and arranged to detect both the light spectrum emitted by the first illumination assembly (4, 6) and by the second illumination assembly (8, 10), and each of a subsequent image evaluation based on both The imaging sensors (12, 14) each at least partially the same optical beam path for receiving the visible light reflected from the component (2) and for receiving the component (2) penetrating infrared Use light.