FILM FOR PROTECTION FILM FORMATION, SHEET FOR PROTECTION FILM FORMATION, METHOD FOR MANUFACTURING WORK OR WORKPIECES, INSPECTION METHOD, AND WORK AND WORKPIECE JUDGED AS ACCEPTABLE ITEMS

摘要

To provide: a film for protection film formation and a sheet for protection film formation, which are each to be stuck to the backside of a work such as a semiconductor wafer, thereby allowing a protection film to be formed on the backside of each workpiece such as a semiconductor chip, which are suitable for dividing the work by a division-by-tension method of a quality-modified layer-breaking type in a process from the step of being stuck to the backside of the work to the step of obtaining the workpieces, and which make each workpiece with such a protection film stuck to the backside thereof suitable for performing an infrared light inspection thereon; a method for manufacturing a work or workpieces by use thereof; an inspection method by use thereof; and a work and a workpiece, which are judged as acceptable items by the inspection method.SOLUTION: A film 1 for protection film formation has a transmittance of 60% or more to light of a wavelength 1064 nm and a transmittance of 65% or more to light of a wavelength 1250 nm.SELECTED DRAWING: Figure 2