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Fabrication of PCBs and FPCs with shielded tracks and / or components using 3D inkjet printing

机译:使用3D喷墨打印制造具有屏蔽走线和/或组件的PCB和FPC

摘要

The present disclosure relates to methods and compositions for directly printing circuit boards having electromagnetically shielded tracks and / or components. In particular, the present disclosure relates to direct, uninterrupted, continuous 3D printing of tracks and / or components with an insulating jacket having a metallic shielding sleeve or capsule. [Selection] Figure 6
机译:本公开涉及用于直接印刷具有电磁屏蔽的轨道和/或部件的电路板的方法和组合物。特别地,本公开涉及利用具有金属屏蔽套筒或胶囊的绝缘护套对轨道和/或部件进行直接,不间断,连续的3D打印。 [选择]图6

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