FABRICATION OF PCB AND FPC WITH SHIELDED TRACKS AND/OR COMPONENTS USING 3D INKJET PRINTING

摘要

The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.