System and method for using z-layer context in logical and hot spot inspection for sensitivity improvement and nuisance suppression

摘要

A system and method for removing nuisance data from a defect scan of a wafer is disclosed. The processor receives a design file corresponding to a wafer having one or more z layers. The processor receives the critical area of the wafer and directs the subsystem to capture a corresponding image of the wafer. Receive the defect location and align the design file with the defect location. News data is identified using potential defect locations and one or more z layers of the aligned design file. The processor then removes the identified nuisance data from one or more potential defect locations.