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Method and apparatus for determining the position of a target structure on a substrate, and method and apparatus for determining the position of a substrate

机译:用于确定目标结构在基板上的位置的方法和设备以及用于确定基板的位置的方法和设备

摘要

Since the target structure (402) such as the alignment mark on the semiconductor substrate (400) is obscured by the opaque layer (408), the position cannot be specified by the alignment sensor (AS). The position of the mark is determined using an edge position sensor (412), and relative position information defining the position of the mark relative to one or more edge portions of the substrate is stored prior to formation of the opaque layer. Based on the determined position, a window (410) can be opened in the opaque layer. After revealing the target structure, the alignment sensor can more accurately measure the position of the target structure for use in controlling further lithography steps, if desired. The edge position sensor may be a camera having angle selective behavior. The edge position sensor may be integrated within the alignment sensor hardware. [Selection] Figure 4
机译:由于诸如半导体衬底(400)上的对准标记的目标结构(402)被不透明层(408)遮盖,因此该位置不能由对准传感器(AS)指定。使用边缘位置传感器(412)确定标记的位置,并且在形成不透明层之前存储定义标记相对于基板的一个或多个边缘部分的位置的相对位置信息。基于所确定的位置,可以在不透明层中打开窗口(410)。在露出目标结构之后,如果需要,对准传感器可以更精确地测量目标结构的位置,以用于控制进一步的光刻步骤。边缘位置传感器可以是具有角度选择行为的照相机。边缘位置传感器可以集成在对准传感器硬件内。 [选择]图4

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