首页> 外国专利> LASER PROCESSING DEVICE, LASER OSCILLATOR DIAGNOSIS METHOD, AND LASER OSCILLATOR DIAGNOSIS PROGRAM

LASER PROCESSING DEVICE, LASER OSCILLATOR DIAGNOSIS METHOD, AND LASER OSCILLATOR DIAGNOSIS PROGRAM

机译:激光加工设备,激光振荡器诊断方法和激光振荡器诊断程序

摘要

A laser cutting device includes a laser oscillator, a cutting nozzle configured to irradiate a work with laser light so as to cut the work, and a controller configured to control the laser oscillator and a drive unit configured to move the cutting nozzle. The controller includes a laser output control unit, a diagnosis performance determination unit configured to determine, when the laser oscillator satisfies a predetermined operation condition, based on a cutting program, whether or not the laser oscillator is diagnosed, and a diagnosis function performance unit configured to issue a laser output command for diagnosis of the laser oscillator to the laser oscillator. When the diagnosis performance determination unit determines that the laser oscillator is diagnosed, the diagnosis performance determination unit outputs the laser output command for diagnosis to the laser oscillator.
机译:激光切割装置包括:激光振荡器;切割喷嘴,被配置为用激光照射工件以切割工件;以及控制器,其被配置为控制激光振荡器;以及驱动单元,其被配置为使切割喷嘴移动。控制器包括:激光输出控制单元;诊断性能确定单元,其被配置为在切割程序满足时确定激光振荡器满足预定操作条件时是否诊断出激光振荡器;以及诊断功能执行单元,其被配置为向激光振荡器发出用于诊断激光振荡器的激光输出命令。当诊断性能确定单元确定诊断出激光振荡器时,诊断性能确定单元将用于诊断的激光输出命令输出至激光振荡器。

著录项

  • 公开/公告号JP6599912B2

    专利类型

  • 公开/公告日2019-10-30

    原文格式PDF

  • 申请/专利权人 ファナック株式会社;

    申请/专利号JP20170025975

  • 发明设计人 時任 宏彰;

    申请日2017-02-15

  • 分类号B23K26;

  • 国家 JP

  • 入库时间 2022-08-21 12:20:51

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号