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Method of calculating correction for controlling manufacturing process, metrology apparatus, device manufacturing method, and modeling method

机译:用于控制制造过程的校正计算方法,计量设备,器件制造方法和建模方法

摘要

A correction (CPE) for use in control of the lithographic apparatus (100) is calculated. A metrology device (140) is used to measure (200) performance parameters at sampling locations at one or more substrates to which a lithographic process has been previously applied. The process model is fitted 210 to the measured performance parameters to provide an upsampling estimate for the process induced effects on the substrate. A correction is calculated 230 for use in controlling the lithographic apparatus using the operation model and based at least in part on the adapted process model. In locations where measurement data (312) is available, this data is added (240) to the estimate to replace process model values. Thus, the calculation of the actuation correction is based on the change estimate (316) which is a combination of the values (318) estimated by the process model and partly based on the actual measurement data (312). [Selected figure] Figure 2
机译:计算用于光刻设备(100)的控制的校正(CPE)。计量装置(140)用于测量(200)先前已应用光刻工艺的一个或多个基板的采样位置处的性能参数。将过程模型拟合210到所测量的性能参数,以提供对衬底上的过程诱发的影响的上采样估计。计算校正230以用于使用操作模型并且至少部分地基于适应的处理模型来控制光刻设备。在可获得测量数据(312)的位置,将该数据添加(240)到估计中以替换过程模型值。因此,致动校正的计算基于变化估计值(316),该变化估计值是由过程模型估计的值(318)的组合,并且部分地基于实际测量数据(312)。 [选定图]图2

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