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Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transferring a substrate carrier and a mask carrier in a vacuum chamber

机译:用于基板的真空处理的设备,用于基板的真空处理的系统以及在真空室中转移基板载体和掩模载体的方法

摘要

The present disclosure provides an apparatus (200) for vacuum processing of a substrate (10). The apparatus (200) comprises a vacuum chamber, a first track arrangement (110) adapted to transfer a substrate carrier (120), a second track arrangement (configured to transfer a mask carrier (140) 130) and a holding arrangement configured to position the substrate carrier (120) and the mask carrier (140) relative to one another. The first track arrangement (110) comprises a first portion configured to support a substrate carrier (120) at a first end (12) of the substrate (10) and a substrate carrier (120) 10) and a second portion configured to support at a second end (14) of the substrate (10) opposite the first end (12). The second track arrangement (120) comprises a further first portion configured to support the mask carrier (140) at the first end (22) of the mask (20), and the mask carrier (140) And a further second portion configured to support at a second end (24) of the mask opposite the first end (22) of the mask (20). A first distance (D) between a first part and a second part of the first track arrangement (110), and a further first part of the second track arrangement (130) The second distance (D ') between the second part is essentially the same. [Selected figure] Figure 1B
机译:本公开提供了一种用于真空处理基板(10)的设备(200)。装置(200)包括真空室,适合于转移基板载体(120)的第一轨道装置(110),第二轨道装置(被配置为转移掩模载体(140)130)和保持装置(其被配置为定位)基板载体(120)和掩模载体(140)相对于彼此。第一轨道装置(110)包括配置为在基板(10)的第一端(12)处支撑基板承载器(120)的第一部分和基板承载器(120)10)以及配置为在以下位置支撑的第二部分:衬底(10)的与第一端(12)相对的第二端(14)。第二轨道装置(120)包括被配置为在掩模(20)的第一端(22)处支撑掩模载体(140)的另一第一部分,以及掩模载体(140)以及被配置为支撑第二另外的第二部分。在与掩模(20)的第一端(22)相对的掩模的第二端(24)处。第一轨道装置(110)的第一部分和第二部分之间的第一距离(D)以及第二轨道装置(130)的另一第一部分。第二部分之间的第二距离(D')基本上是相同。 [选定图]图1B

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