首页> 外国专利> METHOD FOR MANUFACTURING ELECTRICAL WIRING MEMBER, MATERIAL FOR FORMING ELECTRICAL WIRING MEMBER, ELECTRICAL WIRING MEMBER, METHOD FOR MANUFACTURING ELECTRICAL WIRING BOARD, MATERIAL FOR FORMING ELECTRICAL WIRING BOARD, ELECTRIC WIRING BOARD, OSCILLATOR, ELECTRONIC EQUIPMENT AND MOVING BODY

METHOD FOR MANUFACTURING ELECTRICAL WIRING MEMBER, MATERIAL FOR FORMING ELECTRICAL WIRING MEMBER, ELECTRICAL WIRING MEMBER, METHOD FOR MANUFACTURING ELECTRICAL WIRING BOARD, MATERIAL FOR FORMING ELECTRICAL WIRING BOARD, ELECTRIC WIRING BOARD, OSCILLATOR, ELECTRONIC EQUIPMENT AND MOVING BODY

机译:电气布线构件的制造方法,电气布线构件的形成材料,电气布线构件,电气布线板的制造方法,电气布线板的形成材料,电气布线板,振荡器,电子设备,移动体

摘要

A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, the surface insulating layer covering the metal particle containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.
机译:用于制造电气配线构件的方法包括:将包含树脂材料和金属颗粒的组合物与绝缘层压模在一起,覆盖包含玻璃材料作为主要材料的金属颗粒的表面绝缘层,从而获得粉末致密层然后,用能量束照射粉体致密层,使被照射区域显示出导电性。

著录项

  • 公开/公告号JP6524780B2

    专利类型

  • 公开/公告日2019-06-05

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20150086199

  • 发明设计人 中村 英文;川崎 琢;

    申请日2015-04-20

  • 分类号H05K3/10;H05K1/09;H05K3;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 12:18:55

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