首页>
外国专利>
Mitigation of electromigration, inrush current effects, IR voltage drop, and jitter by insertion of a matrix of metal lines and vias
Mitigation of electromigration, inrush current effects, IR voltage drop, and jitter by insertion of a matrix of metal lines and vias
展开▼
机译:通过插入金属线和过孔矩阵来减轻电迁移,浪涌电流影响,IR压降和抖动
展开▼
页面导航
摘要
著录项
相似文献
摘要
Integrated circuits and methods of manufacturing such circuits are disclosed herein that feature metal line-via matrix insertion after place and route processes are performed and/or completed for the integrated circuit's layout. The metal line-via matrix consists of one or more additional metal lines and one or more additional vias that are inserted into the integrated circuit's layout at a specific point to lower the current and current density through a first conductive path that has been determined to suffer from electromigration, IR-voltage drop, and/or jitter. Specifically, the metal line-via matrix provides one or more auxiliary conductive paths to divert and carry a portion of the current that would otherwise flow through the first conductive path. This mitigates electromigration issues and IR-voltage drop along the first conductive path. It may also help alleviate problems due to jitter along the path.
展开▼