Polyarylene ether resin, method for producing polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, semiconductor device, prepreg, printed circuit board, build up film, build up substrate

摘要

PROBLEM TO BE SOLVED: To provide a polyarylene ether resin excellent in various physical properties such as heat resistance, fire retardancy and dielectric characteristics in a cured product, and to provide a method for producing the same, a curable resin material and a cured product thereof, a semiconductor sealing material, a semiconductor device, a prepreg, a printed circuit board, a build-up film, and a build-up board.SOLUTION: In a polyarylene ether resin, at least one of aromatic nuclei in a polyarylene ether structure (α) has a naphthalene skeleton, and at least one of the aromatic nuclei in the polyarylene ether structure (α) has a structural site represented by formula (1) on the aromatic nucleus, or a structural site further having a side group containing a hydrocarbon group, an alkoxy group, a hydroxyl group and an X atom on the aromatic nucleus containing x and y in formula (1).SELECTED DRAWING: None