Polyarylene ether resin, method for producing polyarylene ether resin, curable resin material, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, printed circuit board, build-up film, build-up board, fiber reinforced composite material, and Fiber reinforced molded product

摘要

PROBLEM TO BE SOLVED: To provide a polyarylene ether resin excellent in various physical properties of heat resistance, pyrolytic property, moisture resistance and solder resistance, flame retardancy and dielectric property, a manufacturing method of the resin, a cured article thereof, a semiconductor encapsulation material, a semiconductor device, a prepreg, a print circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material and a fiber-reinforced molded article.SOLUTION: There is provided a polyarylene ether resin having a polyarylene ether structure in a molecular structure, where at least one aromatic nuclear thereof has a naphthalene ring structure and at least one aromatic nuclear thereof has two benzoxazine skeletons obtained by reacting the polyarylene ether, an aromatic monohydroxy compound, a diamine compound and formaldehyde.SELECTED DRAWING: None