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Pattern forming method, method of manufacturing processed substrate, method of manufacturing optical component, method of manufacturing circuit substrate, method of manufacturing electronic component, method of manufacturing imprint mold

机译:图案形成方法,加工基板的制造方法,光学零件的制造方法,电路基板的制造方法,电子零件的制造方法,压印模具的制造方法

摘要

Step (1) of laminating a layer comprising a curable composition (A1) containing at least a polymerizable compound (a1) on the surface of a substrate, (1) at least a polymerizable compound (a2) on the curable composition (A1) layer Step (2) of discretely dropping and laminating droplets of the curable composition (A2) containing the composition, the curable composition (A1) and the curable composition (A2) partially between the mold and the substrate Step (3) of sandwiching a layer formed by mixing the two, of the layer formed by partially mixing the two types of curable compositions, the portion sandwiched between the mold and the substrate is irradiated with light from the mold side And a step (5) of sequentially removing the mold from the layer comprising the curable composition after curing, and the curable composition (A1) is a pattern forming method comprising As the polymerizable compound (a1), one of the following Pattern forming method characterized by containing at least a compound represented by formula (1). [Chemical formula 1]
机译:步骤(1)在基材表面上层压包含至少包含可聚合化合物(a1)的可固化组合物(A1)的层,(1)在可固化组合物(A1)层上至少包含可聚合化合物(a2)步骤(2):将包含组合物,可固化组合物(A1)和可固化组合物(A2)的可固化组合物(A2)的液滴离散地滴加和层压在模具和基材之间的部分步骤(3),将形成的层夹在中间通过将两者混合,在将两种类型的可固化组合物部分混合而形成的层中,从模具侧对夹在模具和基板之间的部分进行光照射,并依次从层中取出模具(5)。包含固化后的固化性组合物的固化性组合物和固化性组合物(A1)为包含以下成分的图案形成方法之一,所述图案形成方法为聚合性化合物(a1):由式(1)表示的磅。 [化学式1]

著录项

  • 公开/公告号JPWO2017130853A1

    专利类型

  • 公开/公告日2018-11-15

    原文格式PDF

  • 申请/专利权人 キヤノン株式会社;

    申请/专利号JP20170564210

  • 发明设计人 伊藤 俊樹;

    申请日2017-01-20

  • 分类号H01L21/027;B29C59/02;C08F20/20;C08F20/10;C08F20/12;

  • 国家 JP

  • 入库时间 2022-08-21 12:17:09

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