Step (1) of laminating a layer comprising a curable composition (A1) containing at least a polymerizable compound (a1) on the surface of a substrate, (1) at least a polymerizable compound (a2) on the curable composition (A1) layer Step (2) of discretely dropping and laminating droplets of the curable composition (A2) containing the composition, the curable composition (A1) and the curable composition (A2) partially between the mold and the substrate Step (3) of sandwiching a layer formed by mixing the two, of the layer formed by partially mixing the two types of curable compositions, the portion sandwiched between the mold and the substrate is irradiated with light from the mold side And a step (5) of sequentially removing the mold from the layer comprising the curable composition after curing, and the curable composition (A1) is a pattern forming method comprising As the polymerizable compound (a1), one of the following Pattern forming method characterized by containing at least a compound represented by formula (1). [Chemical formula 1]
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