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Silver-bismuth non-contact metallization pastes for silicon solar cells
Silver-bismuth non-contact metallization pastes for silicon solar cells
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机译:用于硅太阳能电池的银铋非接触金属化浆料
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摘要
Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon.
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