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Circuit package having a plurality of epoxy mold compounds with different compositions
Circuit package having a plurality of epoxy mold compounds with different compositions
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机译:具有多个具有不同成分的环氧模塑料的电路封装
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摘要
A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.
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