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Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
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机译:具有通孔的玻璃基板的制造方法,在玻璃基板上形成通孔的方法以及具有通孔的玻璃基板的制造系统
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摘要
A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d1/Rt1” of a thickness “d1” of the glass substrate with respect to a diameter “Rt1” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.
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机译:一种具有通孔的玻璃基板的制造方法,其特征在于,(1)通过从玻璃基板的第一面侧照射激光,在玻璃基板上形成初始孔。 (2)使用第一蚀刻溶液执行第一蚀刻工艺,以从初始孔形成第一通孔,该第一通孔从形成在第一表面上的第一开口延伸到形成在第二表面上的第二开口,并形成第一通孔。玻璃基板的厚度“ d 1 Sub>”相对于直径“ R ”的比率“ d 1 Sub> / R t1 Sub>”第一开口的t1 Sub>”在10至20之间的范围内; (3)使用第二蚀刻液进行第二蚀刻工序,以扩大第一通孔,该第二蚀刻液相对于玻璃基板的蚀刻速度比第一蚀刻液的蚀刻速度快。
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