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Impedance compensation structure for broadband near-field magnetic-field probe and its construction method

机译:宽带近场磁场探头的阻抗补偿结构及其构建方法

摘要

An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.
机译:一种宽带近场磁场探头的阻抗补偿结构,包括:信号通孔;多个接地通孔设置在信号通孔周围,以形成同轴通孔阵列。其中,所述接地通孔和所述信号通孔的尺寸相同,所述多个接地通孔中的每一个到所述信号通孔的距离相等,所述多个接地通孔形成以所述信号通孔为中心的圆。其中,多个接地通孔中的每一个均与磁场探针顶层屏蔽平面和磁场探针底层屏蔽平面连接;多个接地通孔中的每个接地通孔保持从直流到高频的导通状态,从而实现宽带近场磁场探头的阻抗匹配。

著录项

  • 公开/公告号US10461386B2

    专利类型

  • 公开/公告日2019-10-29

    原文格式PDF

  • 申请/专利权人 BEIHANG UNIVERSITY;

    申请/专利号US201715482735

  • 申请日2017-04-08

  • 分类号H01P3/08;G01R29/08;H05K1/02;G01R31;G06F17/50;

  • 国家 US

  • 入库时间 2022-08-21 12:14:52

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