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Amorphous hydrogenated boron carbide low-k dielectric and method of making the same

机译:非晶氢化碳化硼低k电介质及其制备方法

摘要

A method of forming a low-dielectric-constant amorphous hydrogenated boron carbide film on a substrate includes positioning the substrate within a plasma enhanced chemical vapor deposition (PECVD) chamber, providing a boron carbide precursor and introducing the boron carbide precursor into a carrier gas to form a carrier gas-precursor mixture. The method also includes introducing the carrier gas-precursor mixture into the PECVD chamber. The method also includes applying radio frequency power within the PECVD chamber to the carrier gas-precursor mixture to form one or more plasmas containing one or more species containing at least one of boron, carbon or hydrogen. The method also includes forming the low-dielectric-constant amorphous hydrogenated boron carbide film on the substrate within the PECVD chamber.
机译:一种在基板上形成低介电常数的非晶态氢化碳化硼薄膜的方法,包括将基板放置在等离子体增强化学气相沉积(PECVD)腔室内,提供碳化硼前驱体并将碳化硼前驱体引入载气以形成载气前体混合物。该方法还包括将载气前体混合物引入PECVD室。该方法还包括在PECVD室内向载气前体混合物施加射频功率,以形成一种或多种等离子体,该等离子体包含一种或多种包含硼,碳或氢中至少一种的物质。该方法还包括在PECVD室内的衬底上形成低介电常数的非晶态氢化碳化硼膜。

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