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Gallium nitride (GaN) power amplifiers (PA) with angled electrodes and 100 CMOS and method for producing the same

机译:具有成角度的电极和100 CMOS的氮化镓(GaN)功率放大器(PA)及其制造方法

摘要

A method of forming a CMOS device and a GaN PA structure on a 100 Si substrate having a surface orientated in 111 direction and the resulting device are provided. Embodiments include forming a device with a protective layer over a portion of a Si substrate; forming a V-shaped groove in the Si substrate; forming a buffer layer, a GaN layer, an AlGaN layer and a passivation layer sequentially over the Si substrate; forming trenches through the passivation and the AlGaN layers; forming second trenches through the passivation layer; forming electrode structures over portions of the passivation layer and filling the first and second trenches; removing portions of the passivation layer, the AlGaN layer and the GaN layer outside of the V-shaped groove down to the buffer layer; forming a dielectric layer over the Si substrate; and forming vias through the dielectric layer down to electrode structures and the device.
机译:提供了一种在具有沿111方向定向的表面的100 Si衬底上形成CMOS器件和GaN PA结构的方法,以及所得的器件。实施例包括在硅衬底的一部分上形成具有保护层的器件;以及在Si衬底上形成V形凹槽;在Si衬底上依次形成缓冲层,GaN层,AlGaN层和钝化层;通过钝化层和AlGaN层形成沟槽;穿过钝化层形成第二沟槽;在钝化层的部分上方形成电极结构并填充第一沟槽和第二沟槽;去除所述钝化层,所述AlGaN层和所述GaN层在所述V形槽之外的部分直至所述缓冲层;在Si衬底上形成介电层;形成从介电层到电极结构和器件的通孔。

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