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Method of forming high dielectric constant dielectric layer by atomic layer deposition

机译:通过原子层沉积形成高介电常数介电层的方法

摘要

A method of forming a high dielectric constant (high-k) dielectric layer by atomic layer deposition includes the following steps. Cycles are performed one after another, and each of the cycles sequentially includes performing a first oxygen precursor pulse to supply an oxygen precursor to a substrate disposed in a reactor; performing a first oxygen precursor purge after the first oxygen precursor pulse; performing a chemical precursor pulse to supply a chemical precursor to the substrate after the first oxygen precursor purge; and performing a chemical precursor purge after the chemical precursor pulse. The first oxygen precursor pulse, the first oxygen precursor purge, the chemical precursor pulse, and the chemical precursor purge are repeated by at least 3 cycles. A second oxygen precursor pulse is performed to supply an oxygen precursor to the substrate after the cycles. A second oxygen precursor purge is performed after the second oxygen precursor pulse.
机译:通过原子层沉积形成高介电常数(高k)电介质层的方法包括以下步骤。循环一个接一个地执行,并且每个循环依次包括执行第一氧前驱体脉冲以将氧前驱体供应到设置在反应器中的基板;在第一氧气前体脉冲之后执行第一氧气前体吹扫;在第一次氧气前驱物净化之后,执行化学前驱物脉冲以将化学前驱物供应到基板;在化学前驱体脉冲之后进行化学前驱体吹扫。将第一氧气前体脉冲,第一氧气前体吹扫,化学前体脉冲和化学前体吹扫重复至少3个循环。在循环之后,执行第二次氧气前驱体脉冲以向基板提供氧气前驱体。在第二氧气前驱体脉冲之后执行第二氧气前驱体吹扫。

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