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Designing and fabricating semiconductor devices with specific terrestrial cosmic ray (TCR) ratings

机译:设计和制造具有特定地面宇宙射线(TCR)额定值的半导体器件

摘要

In one embodiment, a method of manufacturing a silicon-carbide (SiC) device includes receiving a selection of a specific terrestrial cosmic ray (TCR) rating at a specific applied voltage, determining a breakdown voltage for the SiC device based at least on the specific TCR rating at the specific applied voltage, determining drift layer design parameters based at least on the breakdown voltage. The drift layer design parameters include doping concentration and thickness of the drift layer. The method also includes fabricating the SiC device having a drift layer with the determined drift layer design parameters. The SiC device has the specific TCR rating at the specific applied voltage.
机译:在一个实施例中,一种制造碳化硅(SiC)器件的方法包括:在特定的施加电压下接收特定的地面宇宙射线(TCR)额定值的选择;至少基于特定的电压,确定SiC器件的击穿电压。在特定施加电压下的TCR额定值,至少基于击穿电压确定漂移层设计参数。漂移层设计参数包括掺杂浓度和漂移层的厚度。该方法还包括制造具有具有所确定的漂移层设计参数的漂移层的SiC器件。 SiC器件在特定的施加电压下具有特定的TCR额定值。

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