首页> 外国专利> METHOD AND SYSTEM FOR ENGINEERING THE SECONDARY BARRIER LAYER IN DUAL MAGNETIC JUNCTIONS

METHOD AND SYSTEM FOR ENGINEERING THE SECONDARY BARRIER LAYER IN DUAL MAGNETIC JUNCTIONS

机译:双磁结中第二道垒层的工程设计方法和系统

摘要

A magnetic junction, a memory using the magnetic junction and method for providing the magnetic junction are described. The magnetic junction includes first and second reference layers, a main barrier layer, a free layer, an engineered secondary barrier layer and a second reference layer. The free layer is switchable between stable magnetic states when a write current is passed through the magnetic junction. The main barrier layer is between the first reference layer and the free layer. The secondary barrier layer is between the free layer and the second reference layer. The engineered secondary barrier layer has a resistance and a plurality of regions having a reduced resistance less than the resistance. The free and reference layers each has a perpendicular magnetic anisotropy energy and an out-of-plane demagnetization energy less than the perpendicular magnetic anisotropy energy.
机译:描述了磁结,使用该磁结的存储器以及用于提供该磁结的方法。磁结包括第一参考层和第二参考层,主势垒层,自由层,工程次级势垒层和第二参考层。当写入电流通过磁性结时,自由层可在稳定的磁性状态之间切换。主阻挡层在第一参考层和自由层之间。次级阻挡层在自由层和第二参考层之间。工程次级阻挡层具有电阻和多个区域,该多个区域的减小的电阻小于该电阻。自由层和参考层各自具有垂直磁各向异性能和小于垂直磁各向异性能的面外退磁能。

著录项

  • 公开/公告号US2019319182A1

    专利类型

  • 公开/公告日2019-10-17

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US201916453854

  • 申请日2019-06-26

  • 分类号H01L43/02;H01L27/22;H01L43/10;H01L43/12;H01L43/08;

  • 国家 US

  • 入库时间 2022-08-21 12:12:26

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