首页> 外国专利> Vertical high voltage semiconductor apparatus and fabrication method of vertical high voltage semiconductor apparatus

Vertical high voltage semiconductor apparatus and fabrication method of vertical high voltage semiconductor apparatus

机译:垂直高压半导体装置及垂直高压半导体装置的制造方法

摘要

A silicon carbide vertical MOSFET includes an N-counter layer of a first conductivity type formed in a surface layer other than a second semiconductor layer base layer selectively formed in a low concentration layer on a surface of the substrate, a gate electrode layer formed through a gate insulating film in at least a portion of an exposed portion of a surface of a third semiconductor layer of a second conductivity type between a source region of the first conductivity type and the N-counter layer of the first conductivity type, and a source electrode in contact commonly with surfaces of the source region and the third semiconductor layer. Portions of the second conductivity type semiconductor layer are connected with each other in a region beneath the N-counter layer.
机译:碳化硅垂直MOSFET包括形成在除了第二半导体层基础层以外的表面层中,选择性地形成在衬底表面上的低浓度层中的表面层中的第一导电类型的N-对置层,通过电极形成的栅电极层。在第一导电类型的源极区域和第一导电类型的N对层之间的第二导电类型的第三半导体层的表面的暴露部分的至少一部分中的栅极绝缘膜和源极分别与源极区和第三半导体层的表面接触。第二导电类型半导体层的部分在N对置层下方的区域中彼此连接。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号