Multilayer 3D memory based on network-on-chip interconnection

摘要

Embodiments described herein generally relate to the use of three-dimensional solid state memory structures, both volatile and non-volatile, utilizing a Network-on-Chip routing protocol which provide for the access of memory storage via a router. As such, data may be sent to and/or from memory storage as data packets on the chip. The Network-on-Chip routing protocol may be utilized to interconnect unlimited numbers of three-dimensional memory cell matrices, spread on a die, or multiple dies, thus allowing for reduced latencies among matrices, selective power control, unlimited memory density growth without major latency penalties, and reduced parasitic capacitance and resistance. Other benefits include a reduction in total density as compared to two-dimensional solid state memory structures utilizing a Network-on-Chip routing protocol, improved signal integrity, larger die areas, improved bandwidths and higher frequencies of operation.