There is provided an electrical contact member including: a conductive base material; and an Ag—Sn alloy plated layer formed on the conductive base material, wherein the Ag—Sn alloy plated layer has a first Ag—Sn alloy plated layer having an Sn concentration of 5 to 38 at. % and a Vickers hardness of 100 or more Hv and less than 300 Hv and a second Ag—Sn alloy plated layer having a Vickers hardness higher than that of the first Ag—Sn alloy plated layer in this order from the outermost layer.
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