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Metal PCB, headlight module having metal PCB applied thereto, and method for assembling headlight module

机译:金属PCB,应用了金属PCB的前照灯模块以及组装前照灯模块的方法

摘要

Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.
机译:提供一种金属PCB,其上施加有金属PCB的前照灯模块以及用于组装前照灯模块的方法,其中金属PCB具有由金属材料制成并构造为薄板的基底,或者该基底具有预定的厚度。基板的厚度为一定厚度,并且通过形成在基板后表面上的弯曲槽在期望的方向上弯曲,并且基座具有在其上集成的多个芯片安装部,从而在其上安装一个或多个LED芯片,并且芯片安装部以一定距离隔开。预定间隔并具有至少两个切口表面的一部分形成在基座的一侧上,使得芯片安装部分倾斜并安装成相对于基座具有预定角度。

著录项

  • 公开/公告号US10247378B2

    专利类型

  • 公开/公告日2019-04-02

    原文格式PDF

  • 申请/专利权人 ECOCAB.CO. LTD;

    申请/专利号US201615745363

  • 发明设计人 CHANG-WON KIM;

    申请日2016-12-28

  • 分类号B60Q1;F21S41/19;H01L33/64;H05K1/02;H05K1/05;H05K1/18;F21V29/503;F21V29/89;F21S41/141;F21S45/47;H01L23/538;H01L25/075;H01L33/62;F21S43/19;F21S43/14;F21Y115/10;

  • 国家 US

  • 入库时间 2022-08-21 12:11:04

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