Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus

摘要

To perform highly accurate cutting according to stable power feed from a machining power supply, a wire electric discharge machining apparatus includes a wire wound over main guide rollers a plurality of times to simultaneously perform a plurality of kinds of cutting. Wire laying work for a plurality of the wires on power feed elements is reduced, uniform power is fed to cutting wire sections, stable machining is intended, and according to alignment positions, for each of units, a plurality of the power feed elements are aligned to correspond to a wire parallel arrangement interval of the cutting wire sections set as power feed targets and are disposed to feed power to the cutting wire sections with an interval of at least every other cutting wire section.