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PRESSURE SENSOR STRUCTURE CONFIGURED FOR WAFER-LEVEL CALIBRATION
PRESSURE SENSOR STRUCTURE CONFIGURED FOR WAFER-LEVEL CALIBRATION
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机译:晶圆级校准配置的压力传感器结构
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摘要
A wafer structure configured for wafer-level calibration of a plurality of pressure sensors, the wafer structure includes: a microelectromechanical systems (MEMS) wafer that includes a plurality of MEMS dice that are separated by a plurality of MEMS-wafer dicing areas; an application-specific integrated circuit (ASIC) wafer that includes a plurality of ASIC-wafer dice that are separated by a plurality of ASIC-wafer dicing areas; a Film on Wafer (FOW) that bonds the MEMS wafer to the ASIC wafer; a plurality of thru silicon vias (TSVs) extending through the ASIC wafer; and a plurality of metallizations extending through the FOW thereby creating an electrical connection between the ASIC wafer and the MEMS wafer thereby enabling wafer-level calibration of the plurality of pressure sensors. The MEMS wafer and the ASIC wafer may each include alignment features for aligning the MEMS wafer with the ASIC wafer.
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