首页>
外国专利>
LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD
LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD
展开▼
机译:具有内部过模制的基于层压的包装
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.
展开▼