BONDING AND PLACEMENT TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS

摘要

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.