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Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
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机译：用于键合机的键合工具，用于键合半导体元件的键合机以及相关方法
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摘要
A bonding tool is provided for bonding a first workpiece to a second workpiece on a bonding machine. The bonding tool includes a body portion for bonding a first workpiece to a second workpiece on a bonding machine. In addition, the bonding tool includes a curing system for curing the adhesive provided between the first and second workpieces.
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