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Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
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机译:用于粘合机的粘接工具,用于粘合半导体元件的粘合机,以及相关方法
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摘要
A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
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