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METHOD OF SEMICONDUCTOR DEVICE FABRICATION HAVING APPLICATION OF MATERIAL WITH CROSS-LINKABLE COMPONENT
METHOD OF SEMICONDUCTOR DEVICE FABRICATION HAVING APPLICATION OF MATERIAL WITH CROSS-LINKABLE COMPONENT
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机译:利用具有可交联成分的材料的半导体器件制造方法
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摘要
Provided is a material composition and method for that includes providing a primer material including a surface interaction enhancement component, and a cross-linkable component. A cross-linking process is performed on the deposited primer material. The cross-linkable component self-cross-links in response to the cross-linking process to form a cross-linked primer material. The cross-lined primer material can protect an underlying layer while performing at least one process on the cross-linked primer material.
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