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High-power LED street lamp with weak light error and method for manufacturing it

机译:具有弱光误差的大功率led路灯及其制造方法

摘要

Disclosed is a low light failure high power LED street lamp and a method for manufacturing the same. A color mark is made in advance on a tail end surface used for manufacturing an N-type semiconductor element (6) or a P-type semiconductor element (7); then the N-type semiconductor element (6) and P-type semiconductor element (7) are arranged in a manner of matrix between an upper beryllium-oxide ceramic wafer (8) and a lower beryllium-oxide ceramic wafer (9), so that the head end of the N-type semiconductor element (6) is connected with the tail end of the P-type semiconductor element (7) or the tail end of the N-type semiconductor element (6) is connected with the head end of the P-type semiconductor element (7), then the lower beryllium-oxide ceramic wafer (9) is attached, through a graphene thermal conductive greaseon layer (4), on the backside of the circuit board (2) which is mounted with LED bulbs (3), and a heat sink (15) is mounted on the upper beryllium-oxide ceramic wafer (8), then the circuit board (2) together with the heat sink (15) are mounted into a street lamp housing (1).
机译:公开了一种低光故障大功率LED路灯及其制造方法。在用于制造N型半导体元件(6)或P型半导体元件(7)的尾端表面上预先形成颜色标记。然后将N型半导体元件(6)和P型半导体元件(7)以矩阵的方式布置在上氧化铍陶瓷晶片(8)和下氧化铍陶瓷晶片(9)之间, N型半导体元件(6)的前端与P型半导体元件(7)的后端连接,或者N型半导体元件(6)的后端与前端连接。在P型半导体元件(7)的一部分上,然后通过石墨烯导热油脂层(4)将下部氧化铍陶瓷晶片(9)附接至电路板(2)的背面,将LED灯泡(3)和散热器(15)安装在上氧化铍陶瓷晶片(8)上,然后将电路板(2)与散热器(15)一起安装在路灯外壳( 1)。

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