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Low light failure, high-power led street lamp and method for manufacturing the same

机译:低光故障大功率led路灯及其制造方法

摘要

Disclosed are a low-light-failure high-power LED road lamp and a manufacturing method therefor. The method comprises: making a colour mark in advance on a tail end surface used for manufacturing N-type semiconductor elements (6) or P-type semiconductor elements (7); and arranging the N-type semiconductor elements (6) and the P-type semiconductor elements (7) in a matrix form between an upper beryllium-oxide ceramic chip (8) and a lower beryllium-oxide ceramic chip (9) which are provided with conductive circuits, to make the head end of each column of N-type semiconductor elements (6) connected in series connect to the tail end of the P-type semiconductor elements (7) or the tail end of each column of N-type semiconductor elements (6) connect to the head end of the P-type semiconductor elements (7), then attaching the lower beryllium-oxide ceramic chip (9) to the back surface of a circuit board (2) equipped with LED bulbs (3) through a graphene heat conduction grease layer (4), installing radiators (15) on the upper beryllium-oxide ceramic chip (8), and then installing both the circuit board (2) and the radiators (15) in a road lamp housing (1).
机译:公开了一种低光失败大功率LED路灯及其制造方法。该方法包括:在用于制造N型半导体元件(6)或P型半导体元件(7)的尾端面上预先形成颜色标记;将N型半导体元件(6)和P型半导体元件(7)以矩阵状配置在设置的上氧化铍陶瓷芯片(8)和下氧化铍陶瓷芯片(9)之间。通过导电电路,使串联连接的每列N型半导体元件(6)的前端连接到P型半导体元件(7)的尾端或N型半导体的每列的末端将半导体元件(6)连接到P型半导体元件(7)的前端,然后将下部氧化铍陶瓷芯片(9)固定到装有LED灯泡(3)的电路板(2)的背面)通过石墨烯导热油脂层(4),在上氧化铍陶瓷芯片(8)上安装散热器(15),然后将电路板(2)和散热器(15)都安装在路灯外壳中(1)。

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