-). However, the exact corrosion activation mechanism remains unclear and hence the effective corrosion prevention cannot be achieved. A novel immersion corrosion screening metrology was utilized as an in situ characterization tool to establish the corrosion mechanism directly relevant to Cu wire-bonded devices. With this improved understanding of Al bond pad corrosion mechanism, significant progress has been made toward developing effective corrosion prevention strategies to improve and ensure the overall packaging reliability."/>
公开/公告号WO2018218217A2
专利类型
公开/公告日2018-11-29
原文格式PDF
申请/专利权人 UNIVERSITY OF NORTH TEXAS;
申请/专利号WO2018US34757
申请日2018-05-25
分类号C09D7/48;
国家 WO
入库时间 2022-08-21 11:57:54