Mechanistic investigation and prevention of corrosion of Al bond pads in Cu wire bonded device assemblies

摘要

Severe corrosion on aluminum (AL) bond pads, with the appearance of "mud cracking" in parts bonded with copper (Cu) wires, can be decisively significant failure modes, particularly under harsh conditions such as automotive environments.This corrosion may be related to the presence of contaminants such as chloride ions (Cl -).However, since the mechanism of accurate corrosion activation remains unclear, effective corrosion prevention cannot be achieved.A new immersion corrosion screening method was used as an in situ characterization tool to establish corrosion mechanisms directly related to Cu wire bonded devices.This improved understanding of the corrosion mechanism of Al bond pads is well developed to develop effective corrosion prevention strategies to improve and secure the overall reliability of the implementation.Diagram