ADDITIVE FOR ELECTROLYTIC PLATING SOLUTIONS, ELECTROLYTIC PLATING SOLUTION CONTAINING SAID ADDITIVE FOR ELECTROLYTIC PLATING SOLUTIONS, AND ELECTROLYTIC PLATING METHOD USING SAID ELECTROLYTIC PLATING SOLUTION

摘要

The purpose of the present invention is to provide: an additive for electrolytic plating solutions, which enables the formation of a metal layer that has excellent surface flatness; an electrolytic plating solution which contains this additive for electrolytic plating solutions; and an electrolytic plating method which uses this electrolytic plating solution. In order to achieve the above-described purpose, an additive for electrolytic plating solutions according to the present invention contains at least one compound selected from among the compounds represented by chemical formulae (1)-(4). In addition, an electrolytic plating solution according to the present invention contains this additive for electrolytic plating solutions; and an electrolytic plating method according to the present invention uses this electrolytic plating solution.