Additive for electrolytic plating solution, electrolytic plating solution containing additive for electrolytic plating solution, and electrolytic plating method using the electrolytic plating solution

摘要

An object of the present invention is to provide an additive for an electrolytic plating solution capable of forming a metal layer having excellent surface flatness, an electrolytic plating solution containing the electrolytic plating solution additive, and an electrolytic plating method using the electrolytic plating solution. In order to achieve the above object, the present invention is an additive for an electrolytic plating solution containing at least one member selected from compounds represented by the formulas (1) to (4) described herein. Moreover, this invention is an electrolytic plating liquid containing the additive for electrolytic plating liquid. Further, the present invention is an electrolytic plating method using the electrolytic plating solution.