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GROUP III-NITRIDE (III-N) DEVICES WITH IMPROVED RF PERFORMANCE AND THEIR METHODS OF FABRICATION
GROUP III-NITRIDE (III-N) DEVICES WITH IMPROVED RF PERFORMANCE AND THEIR METHODS OF FABRICATION
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机译:射频性能得到改善的III类氮化物(III-N)装置及其制造方法
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摘要
A device including a III-N material is described. The device includes a transistor structure having a first layer including a first group III-nitride (III-N) material, a polarization charge inducing layer above the first layer, the polarization charge inducing layer including a second III-N material, a gate electrode above the polarization charge inducing layer and a source structure and a drain structure on opposite sides of the gate electrode. The device further includes a plurality of peripheral structures adjacent to transistor structure, where each of the peripheral structure includes the first layer, but lacks the polarization charge inducing layer, an insulating layer above the peripheral structure and the transistor structure, wherein the insulating layer includes a first dielectric material. A metallization structure, above the peripheral structure, is coupled to the transistor structure.
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