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GROUP III-NITRIDE (III-N) DEVICES WITH IMPROVED RF PERFORMANCE AND THEIR METHODS OF FABRICATION

机译:射频性能得到改善的III类氮化物(III-N)装置及其制造方法

摘要

A device including a III-N material is described. The device includes a transistor structure having a first layer including a first group III-nitride (III-N) material, a polarization charge inducing layer above the first layer, the polarization charge inducing layer including a second III-N material, a gate electrode above the polarization charge inducing layer and a source structure and a drain structure on opposite sides of the gate electrode. The device further includes a plurality of peripheral structures adjacent to transistor structure, where each of the peripheral structure includes the first layer, but lacks the polarization charge inducing layer, an insulating layer above the peripheral structure and the transistor structure, wherein the insulating layer includes a first dielectric material. A metallization structure, above the peripheral structure, is coupled to the transistor structure.
机译:描述了一种包括III-N材料的装置。该装置包括晶体管结构,该晶体管结构具有包括第一III族氮化物(III-N)材料的第一层,在第一层上方的极化电荷诱导层,包括第二III-N材料的极化电荷诱导层,栅电极。极化电荷感应层上方的栅极上方的源极结构和漏极结构上方。该器件还包括与晶体管结构相邻的多个外围结构,其中每个外围结构都包括第一层,但是缺少极化电荷感应层,在外围结构上方的绝缘层和晶体管结构,其中,绝缘层包括:第一介电材料。在外围结构上方的金属化结构耦合到晶体管结构。

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