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SYSTEMS AND METHODS FOR COMBINED X-RAY REFLECTOMETRY AND PHOTOELECTRON SPECTROSCOPY

机译:X射线反射光度法和光电子能谱相结合的系统和方法

摘要

Methods and systems for measuring structural and material characteristics of semiconductor structures based on combined x-ray reflectometry (XRR) and x-ray photoelectron spectroscopy (XPS) are presented herein. A combined XRR and XPS system, includes an x-ray illumination source and x-ray illumination optics shared by both the XRI and XPS measurement subsystems. This increases throughput and measurement accuracy by simultaneously collecting XRR and XPS measurement data from the same area of the wafer. A combined XRR and XPS system improves measurement accuracy by employing XRR measurement data to improve measurements performed by the XPS subsystem, and vice-versa. In addition, a combined XRR and XPS system, enables simultaneous analysis of both XRR and XPS measurement data to more accurately estimate values of one of more parameters of interest. In a further aspect, any of measurement spot size, photon flux, beam shape, beam diameter, and illumination energy are independently controlled.
机译:本文介绍了基于组合的X射线反射法(XRR)和X射线光电子能谱(XPS)来测量半导体结构的结构和材料特性的方法和系统。 XRR和XPS组合的系统包括XRI和XPS测量子系统共享的X射线照明源和X射线照明光学器件。通过同时从晶圆的同一区域收集XRR和XPS测量数据,可以提高生产量和测量精度。 XRR和XPS的组合系统通过使用XRR测量数据来改进XPS子系统执行的测量来提高测量精度,反之亦然。另外,结合使用XRR和XPS系统可以同时分析XRR和XPS测量数据,以更准确地估算感兴趣的多个参数之一的值。在另一方面,测量光斑尺寸,光子通量,光束形状,光束直径和照明能量中的任何一个均被独立控制。

著录项

  • 公开/公告号WO2019136189A1

    专利类型

  • 公开/公告日2019-07-11

    原文格式PDF

  • 申请/专利权人 KLA-TENCOR CORPORATION;

    申请/专利号WO2019US12235

  • 申请日2019-01-04

  • 分类号G01N23/20008;G01N21/27;G01B15/02;G01B15/08;G01J3/50;

  • 国家 WO

  • 入库时间 2022-08-21 11:53:59

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