COPPER CLAD LAMINATE AND METALIZATION METHOD FOR MICROPORES THEREOF

摘要

A copper clad laminate (10) and a metalization method for micropores thereof. The method comprises the following steps: providing a substrate (11) consisting of an insulating material; using laser drilling to drill micropores having a diameter of 2-30 μm into the substrate (11); simultaneously implanting a first electrically conductive material into the surface of the substrate (11) and the pore walls of the micropores at a specific depth by means of ion implantation, so as to form an ion implanted layer (13); and implanting a second electrically conductive material into the pore walls of the micropores by means of focused ion implantation, so as to form an enhanced ion implanted layer (18). The current density of the ion beam forming the enhanced ion implanted layer (18) in the copper clad laminate (10) having metallized micropores is many times higher than the current density of the ion beam forming the ion implanted layer (13).