首页> 外国专利> THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE

THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE

机译:导热复合颗粒,相同制造方法,绝缘树脂成分,绝缘树脂模制体,电路板层压板,金属基电路板和电源模块

摘要

The present invention provides thermally conductive composite particles, each of which is provided with a core part that contains inorganic particles and a shell part that contains nitride particles and covers the core part. The thermally conductive composite particles have been sintered.
机译:本发明提供导热复合颗粒,其每一个都具有包含无机颗粒的核部分和包含氮化物颗粒并覆盖该核部分的壳部分。导热复合颗粒已经被烧结。

著录项

  • 公开/公告号WO2019189794A1

    专利类型

  • 公开/公告日2019-10-03

    原文格式PDF

  • 申请/专利权人 NHK SPRING CO. LTD.;

    申请/专利号WO2019JP14078

  • 发明设计人 SUZUKI KOHEI;MARUICHI TOSHIAKI;

    申请日2019-03-29

  • 分类号H01L23/36;C01F7/02;C04B35/626;C04B35/628;C08K3/28;C08L101;H01B3/30;H01L23/12;H01L23/373;H05K1/05;

  • 国家 WO

  • 入库时间 2022-08-21 11:52:56

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