FOD FOD adhesive film of semiconductor controller embedding type and Semiconductor package

摘要

The present invention relates to a controller die-embedded adhesive film applied to a semiconductor package of a film on die (FOD) type, and a semiconductor package using the same. More specifically, the present invention relates to the controller die-embedded adhesive film capable of facilitating wire bonding without the contamination of an adhesive layer by minimizing the amount of adhesive layers flowing out to the outside while improving the reliability by suppressing a void due to an air gap by effectively embedding the controller die, and to the semiconductor package using the same.