TSV APPARATUS AND METHOD FOR REPAIRING CLUSTERED FAULT IN IRREGULARLY PLACED THROUGH SILICON VIAS

摘要

The present invention relates to a technique for determining a repair structure of an unbalanced through silicon via (TSV) in consideration of a group failure, wherein a processor according to an embodiment includes a semiconductor chip, Through silicon vias (TSVs) located in the at least one region, and a redundant through silicon vias (TSV) are formed in consideration of the calculated density, And a through silicon via (TSV) disposed in the at least one region including the disposed extra via silicon vias (TSV). And a connection performing unit for performing connection to the through silicon vias (TSV) W may include a generator for generating a repair geometry repair geometry for the semiconductor chip.