LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES AND METHOD FOR BONDING DISSIMILAR ELECTRODES TO ELECTRONIC COMPONENTS

摘要

Ag-Cu-based solder material or Sn-Sb material when soldering a package having an electrode subjected to Ni / Au plating or Ag-Pd alloy plating to a printed circuit board having a Cu electrode or a Cu- A solid phase diffusion layer is formed inside the laminated solder material for hetero-electrode bonding by heating and cooling a laminated solder material for a hetero-electrode bonding which is a bonding material of a wrought material and a Sn-Ag-Cu-Ni type solder material or a Sn-Pb type solder material The Sn-Ag-Cu-based solder material or the Sn-Pb-based solder material contacts the Cu electrode and the Sn-Ag-Cu-Ni based solder material or the Sn-Cu based solder material is plated with Ni / Au or Ag- In the state of being in contact with the electrode thus formed, the electrode to which the Ni / Au plating or the Ag-Pd alloy plating is applied and the electrode to which the Cu electrode or the Cu plating is applied are soldered to suppress the formation of the intermetallic compound at the bonding interface Solder joint with high junction reliability.